6

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11)

Solder Reflow Temperature Profile

1.00 ± 0.15

(0.039 ± 0.006)

12.30 ± 0.30

(0.484 ± 0.012)

0.75 ± 0.25

(0.030 ± 0.010)

11.00

(0.433)

5

6

7

8

4

3

2

1

11.23 ± 0.15

(0.442 ± 0.006)

9.00 ± 0.15

(0.354 ± 0.006)

1.3

(0.051)

13.56

(0.534)

2.29

(0.09)

LAND PATTERN RECOMMENDATION

1.80 ± 0.15

(0.071 ± 0.006)

4.00

(0.158) MAX.

1.55

(0.061)

MAX.

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

0.254 + 0.076

- 0.0051

(0.010 + 0.003)

- 0.002)

MAX.

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160

°C

140

°C

150

°C

PEAK

TEMP.

245

°C

PEAK

TEMP.

240

°C

PEAK

TEMP.

230

°C

SOLDERING

TIME

200

°C

PREHEATING TIME

150

°C, 90 + 30 SEC.

2.5 C ± 0.5

°C/SEC.

3

°C + 1 °C/–0.5 °C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3

°C + 1 °C/–0.5 °C/SEC.

REFLOW HEATING RATE 2.5

°C ± 0.5 °C/SEC.

NOTE: NON-HALIDE FLUX SHOULD BE USED.