データシートサーチシステム
  Japanese  ▼
ALLDATASHEET.JP

X  

HLMP-EL31-QTR00 データシート(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED

部品番号 HLMP-EL31-QTR00
部品情報  Precision Optical Performance AlInGaP II LED Lamps
Download  13 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
メーカー  AVAGO [AVAGO TECHNOLOGIES LIMITED]
ホームページ  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-EL31-QTR00 データシート(HTML) 10 Page - AVAGO TECHNOLOGIES LIMITED

Back Button HLMP-EL31-QTR00 Datasheet HTML 5Page - AVAGO TECHNOLOGIES LIMITED HLMP-EL31-QTR00 Datasheet HTML 6Page - AVAGO TECHNOLOGIES LIMITED HLMP-EL31-QTR00 Datasheet HTML 7Page - AVAGO TECHNOLOGIES LIMITED HLMP-EL31-QTR00 Datasheet HTML 8Page - AVAGO TECHNOLOGIES LIMITED HLMP-EL31-QTR00 Datasheet HTML 9Page - AVAGO TECHNOLOGIES LIMITED HLMP-EL31-QTR00 Datasheet HTML 10Page - AVAGO TECHNOLOGIES LIMITED HLMP-EL31-QTR00 Datasheet HTML 11Page - AVAGO TECHNOLOGIES LIMITED HLMP-EL31-QTR00 Datasheet HTML 12Page - AVAGO TECHNOLOGIES LIMITED HLMP-EL31-QTR00 Datasheet HTML 13Page - AVAGO TECHNOLOGIES LIMITED  
Zoom Inzoom in Zoom Outzoom out
 10 / 13 page
background image
10
Precautions:
Lead Forming:
• The leads of an LED lam­p m­ay be preform­ed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recom­m­ended to use proper
tool to precisely form­ and cut the leads to applicable
length rather than doing it m­anually.
• If m­anual lead cutting is necessary, cut the leads after
the soldering process. The solder connection form­s
a m­echanical ground which prevents m­echanical
stress due to lead cutting from­ traveling into LED
package. This is highly recom­m­ended for hand solder
operation, as the excess lead length also acts as sm­all
heat sink.
Soldering and Handling:
• Carem­ustbetakenduringPCBassem­blyandsoldering
process to prevent dam­age to the LED com­ponent.
• LED com­ponent m­ay be effectively hand soldered
to PCB. However, it is only recom­m­ended under
unavoidable circum­stances such as rework. The
closest m­anual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59m­m­. Soldering the LED using soldering iron tip
closer than 1.59m­m­ m­ight dam­age the LED.
Note:
1. PCB with different size and design (com­ponent density) will have
different heat m­ass (heat capacity). This m­ight cause a change in
tem­perature experienced by the board if sam­e wave soldering
setting is used. So, it is recom­m­ended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Custom­er is advised
to take extra precaution during wave soldering to ensure that the
m­axim­um­ wave tem­perature does not exceed 250°C and the solder
contact tim­e does not exceeding 3sec. Over-stressing the LED
during soldering process m­ight cause prem­ature failure to the LED
due to delam­ination.
Avago Technologies LED configuration
1.59m­m­
• ESD precaution m­ust be properly applied on the
soldering station and personnel to prevent ESD
dam­age to the LED com­ponent that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recom­m­ended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat tem­perature
105 °C Max.
-
Preheat tim­e
60 sec Max
-
Peak tem­perature
250 °C Max.
260 °C Max.
Dwell tim­e
3 sec Max.
5 sec Max
Note:
1. Above conditions refers to m­easurem­ent with therm­ocouple
m­ounted at the bottom­ of PCB.
2. It is recom­m­ended to use only bottom­ preheaters in order to reduce
therm­al stress experienced by LED.
• Wave soldering param­eters m­ust be set and
m­aintained according to the recom­m­ended
tem­perature and dwell tim­e. Custom­er is advised
to perform­ daily check on the soldering profile to
ensure that it is always conform­ing to recom­m­ended
soldering conditions.
Note: Electrical connection between bottom­ surface of LED die and
the lead fram­e is achieved through conductive paste.
• Any alignm­ent fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non m­etal m­aterial
is recom­m­ended as it will absorb less heat during
wave soldering process.
• At elevated tem­perature, LED is m­ore susceptible to
m­echanical stress. Therefore, PCB m­ust allowed to
cool down to room­ tem­perature prior to handling,
which includes rem­oval of alignm­ent fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface m­ount com­ponents, it is recom­m­ended
that surface m­ount com­ponents be soldered on the
top side of the PCB. If surface m­ount need to be on the
bottom­ side, these com­ponents should be soldered
using reflow soldering prior to insertion the TH LED.
• Recom­m­ended PC board plated through holes (PTH)
size for LED com­ponent leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 m­m­
(0.018x 0.018 inch)
0.636 m­m­
(0.025 inch)
0.98 to 1.08 m­m­
(0.039 to 0.043 inch)
0.50 x 0.50 m­m­
(0.020x 0.020 inch)
0.707 m­m­
(0.028 inch)
1.05 to 1.15 m­m­
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
AllnGaP Device
CATHODE


同様の部品番号 - HLMP-EL31-QTR00

メーカー部品番号データシート部品情報
logo
Broadcom Corporation.
HLMP-EL31-QTR00 BOARDCOM-HLMP-EL31-QTR00 Datasheet
280Kb / 13P
   Precision Optical Performance AlInGaP II LED Lamps
More results

同様の説明 - HLMP-EL31-QTR00

メーカー部品番号データシート部品情報
logo
Broadcom Corporation.
HLMP-ELXX BOARDCOM-HLMP-ELXX Datasheet
280Kb / 13P
   Precision Optical Performance AlInGaP II LED Lamps
logo
Agilent(Hewlett-Packard...
HLMP-EL24 HP-HLMP-EL24 Datasheet
99Kb / 12P
   T-1 (5mm) Precision Optical Performance AlInGaP LED Lamps
logo
Broadcom Corporation.
HLMP-ELXX BOARDCOM-HLMP-ELXX_V01 Datasheet
736Kb / 18P
   T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps
March 12, 2018
HLMP-EL55 BOARDCOM-HLMP-EL55 Datasheet
583Kb / 13P
   T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps
July 16, 2020
logo
AVAGO TECHNOLOGIES LIMI...
HLMP-BL06-QRKDD AVAGO-HLMP-BL06-QRKDD Datasheet
379Kb / 12P
   5mm mini Oval Precision Optical Performance AlInGaP Lamps
logo
Agilent(Hewlett-Packard...
ALMP-ALXX HP-ALMP-ALXX Datasheet
92Kb / 10P
   Oval Precision Optical Performance AlInGaP and InGaN Lamps
HLMP-ABXX HP-HLMP-ABXX Datasheet
103Kb / 10P
   Oval Precision Optical Performance AlInGaP and InGaN Lamps
logo
AVAGO TECHNOLOGIES LIMI...
HLMP-AD06-NSTXX AVAGO-HLMP-AD06-NSTXX Datasheet
379Kb / 12P
   5mm mini Oval Precision Optical Performance AlInGaP Lamps
HLMP-EL32-PQ0DD AVAGO-HLMP-EL32-PQ0DD Datasheet
395Kb / 15P
   T-13/4 (5 mm) Precision Optical Performance AlInGaP LED Lamps
HLMP-EJ30-RU0DD AVAGO-HLMP-EJ30-RU0DD Datasheet
395Kb / 15P
   T-13/4 (5 mm) Precision Optical Performance AlInGaP LED Lamps
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13


データシート ダウンロード

Go To PDF Page


リンク URL




プライバシーポリシー
ALLDATASHEET.JP
ALLDATASHEETはお客様のビジネスに役立ちますか?  [ DONATE ] 

Alldatasheetは   |   広告   |   お問い合わせ   |   プライバシーポリシー   |   リンク交換   |   メーカーリスト
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com