FDD3570 datasheet(2/8 Pages) FAIRCHILD

部品番号	FDD3570

部品情報	80V N-Channel PowerTrench MOSFET

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FDD3570 Rev. A(W)

Electrical Characteristics

T

A

= 25°C unless otherwise noted16

Symbol

Parameter

Test Conditions

Min Typ Max Units

Off Characteristics

BVDSS

Drain–Source Breakdown Voltage

VGS = 0 V, ID = 250

µA

80

V

∆BVDSS

∆T

J

Breakdown Voltage Temperature

Coefficient

ID = 250

µA,Referenced to 25°C

78

mV/

°C

IDSS

Zero Gate Voltage Drain Current

VDS = 64 V,

VGS = 0 V

1

µA

IGSSF

Gate–Body Leakage Current,

Forward

VGS = 20 V,

VDS = 0 V

100

nA

IGSSR

Gate–Body Leakage Current,

Reverse

VGS = –20 V

VDS = 0 V

–100

nA

On Characteristics

(Note 2)

VGS(th)

Gate Threshold Voltage

VDS = VGS, ID = 250

µA

22.4

4

V

∆VGS(th)

∆T

J

Gate Threshold Voltage

Temperature Coefficient

ID = 250

µA,Referenced to 25°C

-7

mV/

°C

RDS(on)

Static Drain–Source

On–Resistance

VGS = 10 V, ID = 10 A

VGS = 10 V, ID = 10 A,TJ =125

°C

VGS = 6 V, ID = 9 A

0.015

0.027

0.016

0.019

0.038

0.022

Ω

ID(on)

On–State Drain Current

VGS = 10 V,

VDS = 5 V

25

A

gFS

Forward Transconductance

VDS = 5 V,

ID = 14 A

40

S

Dynamic Characteristics

Ciss

Input Capacitance

2800

pF

Coss

Output Capacitance

230

pF

Crss

Reverse Transfer Capacitance

VDS = 40 V,

V GS = 0 V,

f = 1.0 MHz

117

pF

Switching Characteristics (Note 2)

td(on)

Turn–On Delay Time

20

32

ns

tr

Turn–On Rise Time

12

24

ns

td(off)

Turn–Off Delay Time

60

95

ns

tf

Turn–Off Fall Time

VDD = 40 V,

ID = 1 A,

VGS = 10 V,

RGEN = 6

Ω

24

38

ns

Qg

Total Gate Charge

54

76

nC

Qgs

Gate–Source Charge

9.6

nC

Qgd

Gate–Drain Charge

VDS = 40V,

ID = 9 A,

VGS = 10 V

14

nC

Drain–Source Diode Characteristics and Maximum Ratings

IS

Maximum Continuous Drain–Source Diode Forward Current

2.8

A

VSD

Drain–Source Diode Forward

Voltage

VGS = 0 V,

IS = 2.8 A

(Note 2)

0.72

1.2

V

Notes:

1. R

θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of

the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.

a) RθJA = 40°/W when mounted on a

1in

2 pad of 2 oz copper

b) RθJA = 96°/W when mounted on

a minimum pad.

Scale 1 : 1 on letter size paper

2. Pulse Test: Pulse Width < 300

µs, Duty Cycle < 2.0%

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