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AD5421ACPZ-REEL7 データシート(PDF) 11 Page - Analog Devices |
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AD5421ACPZ-REEL7 データシート(HTML) 11 Page - Analog Devices |
11 / 36 page Data Sheet AD5421 Rev. F | Page 11 of 36 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. Table 6. Parameter Rating REGIN to COM −0.3 V to +60 V REGOUT to COM −0.3 V to +14 V Digital Inputs to COM, RANGE0, RANGE1, RINT/REXT, ALARM_CURRENT_DIRECTION, REG_SEL0, REG_SEL1, REG_SEL2 −0.3 V to DVDD + 0.3 V or +7 V (whichever is less) Digital Inputs to COM SCLK, SDIN, SYNC, LDAC −0.3 V to IODVDD + 0.3 V or +7 V (whichever is less) Digital Outputs to COM, SDO, FAULT −0.3 V to IODVDD + 0.3 V or +7 V (whichever is less) REFIN to COM −0.3 V to +7 V REFOUT1, REFOUT2 −0.3 V to +4.7 V VLOOP to COM −0.3 V to +60 V LOOP− to COM −5 V to +0.3 V DVDD to COM −0.3 V to +7 V IODVDD to COM −0.3 V to +7 V REXT1, CIN to COM −0.3 V to +4.3 V REXT2 to COM −0.3 V to +0.3 V DRIVE to COM −0.3 V to +11 V Operating Temperature Range (TA) Industrial −40°C to +105°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ MAX) 125°C Power Dissipation (TJ MAX − TA)/θJA Lead Temperature, Soldering (10 sec) JEDEC Industry Standard J-STD-020 ESD Human Body Model 3 kV Field Induced Charged Device Model 2 kV Machine Model 200 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 7. Thermal Resistance Package Type θJA θJC Unit 28-Lead TSSOP_EP (RE-28-2) 32 9 °C/W 32-Lead LFCSP_WQ (CP-32-11) 40 7 °C/W ESD CAUTION |
同様の部品番号 - AD5421ACPZ-REEL7 |
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同様の説明 - AD5421ACPZ-REEL7 |
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