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ADM1232ARN データシート(PDF) 4 Page - Analog Devices

部品番号 ADM1232ARN
部品情報  Microprocessor Supervisory Circuit
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ホームページ  http://www.analog.com
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ADM1232ARN データシート(HTML) 4 Page - Analog Devices

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ADM1232
Rev. C | Page 4 of
12
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
TA = 25°C unless otherwise noted.
Table 2.
Parameter
Rating
VCC
5.5 V
Logic Inputs
−0.3 V to VCC + 0.3 V
Storage Temperature Range
−65°C to +150°C
Lead Temperature (Soldering, 10 sec)
300°C
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
Power Dissipation
N-81
1000 mW
RW-16, RM-82
900 mW
R-82
900 μW
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
Unit
8-Lead PDIP (N-8)
100
°C/W
16-Lead SOIC_W (RW-16)
73
°C/W
8-Lead MSOP (RM-8)
206
°C/W
8-Lead SOIC_N (R-8)
153
°C/W
ESD CAUTION
1 Derate by 13.5 mW/°C above 25°C.
2 Derate by 12 mW/°C above 25°C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.


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