データシートサーチシステム |
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LMV112 データシート(PDF) 2 Page - Texas Instruments |
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LMV112 データシート(HTML) 2 Page - Texas Instruments |
2 / 22 page LMV112 VCC GND 1 nF EN1 IN1 IN2 EN2 1 1 2 3 4 5 6 7 8 OUT1 OUT2 VCTCXO Rload Rload Cload Cload LOAD1 LOAD2 Enable 2 Enable LMV112 SNAS297B – MAY 2005 – REVISED MAY 2013 www.ti.com TYPICAL APPLICATION Figure 1. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Supply Voltages (V+– V−) 5.5V ESD Tolerance (3) Human Body 2000V Machine Model 200V Storage Temperature Range −65°C to +150°C Junction Temperature (4) +150°C Soldering Information Infrared or Convection (35 sec.) 235°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see the Electrical Characteristics Tables. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Human Body Model: 1.5 k Ω in series with 100 pF. Machine Model: 0Ω in series with 200 pF. (4) The maximum power dissipation is a function of TJ(MAX), θJA , and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) − TA) / θJA. All numbers apply for packages soldered directly onto a PC board. OPERATING RATINGS (1) Supply Voltage (V+ – V−) 2.4V to 5.0V Temperature Range (2) (3) −40°C to +85°C Package Thermal Resistance (2) (3) WSON-8 ( θJA) 217°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see the Electrical Characteristics Tables. (2) The maximum power dissipation is a function of TJ(MAX), θJA , and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) − TA) / θJA. All numbers apply for packages soldered directly onto a PC board. (3) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA . 2 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMV112 |
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同様の説明 - LMV112 |
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