2

Selection Guide–Package Styles and Lead Configuration Options

Package

8 Pin DIP

8 Pin DIP

20 Pad LCCC

Lead Style

Through Hole

Through Hole

Surface Mount

Channels

1

2

2

Common Channel Wiring

None

None

Avago Part # & Options

Commercial

HCPL-5400

HCPL-5430

HCPL-6430

MIL-PRF-38534, Class H

HCPL-5401

HCPL-5431

HCPL-6431

MIL-PRF-38534, Class K

HCPL-540K

HCPL-543K

HCPL-643K

Standard Lead Finish

Gold Plate

Gold Plate

Solder Pads*

Solder Dipped*

Option 200

Option 200

Butt Cut/Gold Plate

Option 100

Option 100

Gull Wing/Soldered*

Option 300

Option 300

Class H SMD Part #

Prescript for all below

5962-

5962-

5962-

Gold Plate

8957001PC

8957101PC

Solder Dipped*

8957001PA

8957101PA

89571022A

Butt Cut/Gold Plate

8957001YC

8957101YC

Butt Cut/Soldered*

8957001YA

8957101YA

Gull Wing/Soldered*

8957001XA

8957101XA

Class K SMD Part #

Prescript for all below

5962-

5962-

5962-

Gold Plate

8957002KPC

8957103KPC

Solder Dipped*

8957002KPA

8957103KPA

8957104K2A

Butt Cut/Gold Plate

8957002KYC

8957103KYC

Butt Cut/Soldered*

8957002KYA

8957103KYA

Gull Wing/Soldered*

8957002KXA

8957103KXA

*Solder contains lead.

Each channel contains an AlGaAs light emitting diode

which is optically coupled to an integrated high gain

photon detector. This combination results in very high

data rate capability. The detector has a threshold with

hysteresis, which typically provides 0.25 mA of differen-

tial mode noise immunity and minimizes the potential for

output signal chatter. The detector in the single channel

units has a three state output stage which eliminates the

need for a pull-up resistor and allows for direct drive of a

data bus.

All units are compatible with TTL, STTL, LSTTL, and HCMOS

logic families. The 35 ns pulse width distortion speci-

fication guarantees a 10 MBd signaling rate at +125° C

with 35% pulse width distortion. Figures 13 through 16

show recommended circuits for reducing pulse width

distortion and optimizing the signal rate of the product.

Package styles for these parts are 8 pin DIP through hole

(case outlines P), and leadless ceramic chip carrier (case

outline 2). Devices may be purchased with a variety of

lead bend and plating options. See Selection Guide Table

for details. Standard Microcircuit Drawing (SMD) parts are

available for each package and lead style.

Because the same electrical die (emitters and detectors)

are used for each channel of each device listed in this

data sheet, absolute maximum ratings, recommended

operating conditions, electrical specifications, and per-

formance characteristics shown in the figures are similar

for all parts. Occasional exceptions exist due to package

variations and limitations and are as noted. Additionally,

the same package assembly processes and materials are

used in all devices. These similarities give justification for

the use of data obtained from one part to represent other

part’s performance for die related reliability and certain

limited radiation test results.