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2PB709BRL データシート(PDF) 3 Page - NXP Semiconductors |
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3 / 13 page 2PB709BRL_2PB709BSL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 1 — 28 June 2010 3 of 13 NXP Semiconductors 2PB709BRL; 2PB709BSL 50 V, 200 mA PNP general-purpose transistors [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Ptot total power dissipation Tamb ≤ 25 °C [1] -250 mW Tj junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C FR4 PCB, standard footprint Fig 1. Power derating curve Table 6. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Tamb (°C) −75 175 125 25 75 −25 006aaa990 100 200 300 Ptot (mW) 0 Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 500 K/W Rth(j-sp) thermal resistance from junction to solder point - - 140 K/W |
同様の部品番号 - 2PB709BRL |
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