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ISL3156EIBZ データシート(PDF) 2 Page - Intersil Corporation |
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ISL3156EIBZ データシート(HTML) 2 Page - Intersil Corporation |
2 / 22 page 2 FN6363.2 July 30, 2009 TABLE 1. SUMMARY OF FEATURES PART NUMBER HALF/FULL DUPLEX DATA RATE (Mbps) SLEW- RATE LIMITED? HOT PLUG # DEVICES ON BUS Rx/Tx ENABLE? QUIESCENT ICC (µA) LOW POWER SHUTDOWN? PIN COUNT ISL3150E Full 0.115 Yes Yes 256 Yes 600 Yes 10, 14 ISL3152E Half 0.115 Yes Yes 256 Yes 600 Yes 8 ISL3153E Full 1 Yes Yes 256 Yes 600 Yes 10, 14 ISL3155E Half 1 Yes Yes 256 Yes 600 Yes 8 ISL3156E Full 20 No Yes 256 Yes 600 Yes 10, 14 ISL3158E Half 20 No Yes 256 Yes 600 Yes 8 Ordering Information PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL3150EIBZ (Notes 1, 3) 3150EIBZ -40 to +85 14 Ld SOIC M14.15 ISL3150EIUZ (Notes 1, 3) 3150Z -40 to +85 10 Ld MSOP M10.118 ISL3152EIBZ (Notes 1, 3) 3152EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3152EIPZ (Notes 2, 3) ISL3152 EIPZ -40 to +85 8 Ld PDIP E8.3 ISL3152EIUZ (Notes 1, 3) 3152Z -40 to +85 8 Ld MSOP M8.118 ISL3153EIBZ (Notes 1, 3) 3153EIBZ -40 to +85 14 Ld SOIC M14.15 ISL3153EIUZ (Notes 1, 3) 3153Z -40 to +85 10 Ld MSOP M10.118 ISL3155EIBZ (Notes 1, 3) 3155EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3155EIUZ (Notes 1, 3) 3155Z -40 to +85 8 Ld MSOP M8.118 ISL3156EIBZ (Notes 1, 3) 3156EIBZ -40 to +85 14 Ld SOIC M14.15 ISL3156EIUZ (Notes 1, 3) 3156Z -40 to +85 10 Ld MSOP M10.118 ISL3158EIBZ (Notes 1, 3) 3158EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3158EIUZ (Notes 1, 3) 3158Z -40 to +85 8 Ld MSOP M8.118 1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. For Moisture Sensitivity Level (MSL), please see device information pages for ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E and ISL3158E. For more information on MSL please see techbrief TB363. Pin Configurations ISL3152E, ISL3155E, ISL3158E (8 LD MSOP, 8 LD SOIC, 8 LD PDIP) TOP VIEW ISL3150E, ISL3153E, ISL3156E (10 LD MSOP) TOP VIEW ISL3150E, ISL3153E, ISL3156E (14 LD SOIC) TOP VIEW RO RE DE DI 1 2 3 4 8 7 6 5 VCC B/Z A/Y GND D R RO RE DE DI GND VCC A B Z Y 1 2 3 4 5 10 9 8 7 6 D R NC RO RE DE DI GND GND VCC NC A B Z Y NC 1 2 3 4 5 6 7 14 13 12 11 10 9 8 D R ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E |
同様の部品番号 - ISL3156EIBZ |
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同様の説明 - ISL3156EIBZ |
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