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IRF7401 データシート(PDF) 3 Page - Analog Devices

部品番号 IRF7401
部品情報  Thermoelectric Cooler Controller
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
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IRF7401 データシート(HTML) 3 Page - Analog Devices

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REV.
ADN8830
–3–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADN8830 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . GND to VS + 0.3 V
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Operating Temperature Range . . . . . . . . . . . . –40
°C to +85°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . 125
°C
Lead Temperature Range (Soldering, 10 sec) . . . . . . . . 300
°C
ESD RATINGS
883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . 1.0 kV
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
PIN CONFIGURATION
PIN 1
INDICATOR
TOP VIEW
24 COMPOSC
23 PGND
22 N1
21 P1
THERMFAULT 1
THERMIN 2
SD 3
20 PVDD
19 OUT A
18 COMPSWIN
17 COMPSWOUT
TEMPSET 4
TEMPLOCK 5
NC 6
VREF 7
AVDD 8
ADN8830
NC = NO CONNECT
Package Type
JA*
JC
Unit
32-Lead LFCSP (ACP)
35
10
°C/W
* JA is specified for worst-case conditions, i.e., JA is specified for a device
soldered in a 4-layer circuit board for surface-mount packages.
D
THE EXPOSED PAD ON THE BOTTOM OF THE
PACKAGE MUST BE CONNECTED TO VCC OR
THE GND PLANE.


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