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ERJ3G データシート(PDF) 4 Page - Panasonic Semiconductor

部品番号. ERJ3G
部品情報  Thick Film Chip Resistors 01005, 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512
ダウンロード  5 Pages
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メーカー  PANASONIC [Panasonic Semiconductor]
ホームページ  http://www.panasonic.com/industrial/
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ERJ3G Datasheet(HTML) 4 Page - Panasonic Semiconductor

   
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Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Thick Film Chip Resistors
Chip Resistor
a
b
Preheating
Peak
Heating
Time
Type
(inches)
Dimensions (mm)
ab
c
ERJXG (01005)
0.15 to 0.20
0.5 to 0.7
0.20 to 0.25
ERJ1G (0201)
0.3 to 0.4
0.8 to 0.9
0.25 to 0.35
ERJ2G (0402)
0.5 to 0.6
1.4 to 1.6
0.4 to 0.6
ERJ3G (0603)
0.7 to 0.9
2 to 2.2
0.8 to 1
ERJ6G (0805)
1 to 1.4
3.2 to 3.8
0.9 to 1.4
ERJ8G (1206)
2 to 2.4
4.4 to 5
1.2 to 1.8
ERJ14(1210)
2 to 2.4
4.4 to 5
1.8 to 2.8
ERJ12 (1812)
3.3 to 3.7
5.7 to 6.5
2.3 to 3.5
ERJ12Z(2010)
3.6 to 4
6.2 to 7
1.8 to 2.8
ERJ1T(2512)
5 to 5.4
7.6 to 8.6
2.3 to 3.5
Temperature
Time
Preheating
140 °C to 160 °C
60 s to 120 s
Main heating
Above 200 °C
30 s to 40 s
Peak
235 ± 5 °C
max. 10 s
Temperature
Time
Preheating
150 °C to 180 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
For soldering
For lead-free soldering
Temperature
Time
Temperature
Time
Preheating
140 °C to 180 °C
60 s to 120 s
150 °C to 180 °C
60 s to 120 s
Soldering
245 ± 5 °C
20 s to 30 s
max. 260 °C
max. 10 s
Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
● Recommended soldering conditions for flow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (hereafter called the
resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Mar. 2005


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