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MCZ33730EK データシート(PDF) 6 Page - Freescale Semiconductor, Inc |
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MCZ33730EK データシート(HTML) 6 Page - Freescale Semiconductor, Inc |
6 / 28 page Analog Integrated Circuit Device Data 6 Freescale Semiconductor 33730 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit Supply Voltage (VBAT) VBAT -0.3 to +40 V Keep-Alive Supply Voltage (KA_VBAT) KA_VBAT -18 to +40 V Control Inputs (V IGN, P1, P2, P3), PFD Output -18 to +40 V Bootstrap Voltage (BOOT, SR) referenced to ground VBOOT -0.3 to +50 V Bootstrap Voltage (BOOT, SR) referenced to SW VBOOT - VSW -0.3 to +12 V Charge Pump Output Voltage (CP) VCP -0.3 to +12 V Switch Node Voltage SW VSW -2.0 to +40 V Sensor Supplies (VREF1, VREF2) VREF -1.0 to +26.5 V Sensor Supplies (VREF1, VREF2) Maximum Slew Rate VREFMAXSR 2.0 V/µs Regulator Voltages (VDDH,VDD3, VDD3_B, VDDL,VDDL_B, VKAM) VREG -0.3 to +7.0 V Open Drain Outputs (RSTH, RSTL, RST3, RSTKAM, IGN_ON) VDD -0.3 to +7.0 V Regon Input VREGON -0.3 to +7.0 V Analog Inputs (VCOMP, INV, FREQ, HRT) VIN -0.3 to +3.0 V ESD Voltage(2) Human Body Model - HBM (all pins except BOOT, VDDL, RSTL) Human Body Model - HBM (Pins BOOT, VDDL, RSTL) Machine Model - MM (all pins) Charge Device Model - CDM (all pins) VESD ±2000 ±1500 ±200 ±750 V Operational Package Temperature (Ambient Temperature) TA_MAX -40 to +125 °C Storage Temperature TSTO -65 to +150 °C Peak Package Reflow Temperature During Reflow(3), (4) TPPRT Note 4 °C Maximum Junction Temperature TJ_MAX 150 °C Thermal Resistance, Junction to Ambient(5) RθJ-A 41 °C/W Thermal Resistance, Junction to Case(6) RθJ-C 1.2 °C/W Notes 2. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2), the Machine Model (MM) (AEC-Q100-003), RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (AEC-Q100-011). 3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 4. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 5. Thermal resistance measured in accordance with EIA/JESD51-2. 6. Theoretical thermal resistance from the die junction to the exposed pad. |
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同様の説明 - MCZ33730EK |
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