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DAC7611UG4 データシート(PDF) 3 Page - Texas Instruments |
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DAC7611UG4 データシート(HTML) 3 Page - Texas Instruments |
3 / 17 page ® 3 DAC7611 1 2 3 4 8 7 6 5 V DD CS CLK SDI V OUT GND CLR LD DAC7611 PIN CONFIGURATION Top View DIP PIN CONFIGURATION Top View SOIC VDD to GND .......................................................................... –0.3V to 6V Digital Inputs to GND ............................................. –0.3V to VDD + 0.3V VOUT to GND ........................................................... –0.3V to VDD + 0.3V Power Dissipation ........................................................................ 325mW Thermal Resistance, θ JA ............................................................ 150°C/W Maximum Junction Temperature ................................................. +150 °C Operating Temperature Range ...................................... –40 °C to +85°C Storage Temperature Range ........................................ –65 °C to +150°C Lead Temperature (soldering, 10s) ............................................. +300 °C NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. ABSOLUTE MAXIMUM RATINGS(1) 1 2 3 4 8 7 6 5 V DD CS CLK SDI V OUT GND CLR LD DAC7611 PIN DESCRIPTION PIN LABEL DESCRIPTION 1VDD Power Supply 2 CS Chip Select (active LOW). 3 CLK Synchronous Clock for the Serial Data Input. 4 SDI Serial Data Input. Data is clocked into the internal serial register on the rising edge of CLK. 5 LD Loads the Internal DAC Register. NOTE: The DAC register is a transparent latch and is transparent when LD is LOW (regardless of the state of CS or CLK). 6 CLR Asynchronous Input to Clear the DAC Register. When CLR is strobbed LOW, the DAC register is set to 000H and the output voltage to 0V. 7 GND Ground 8VOUT Voltage Output. Fixed output voltage range of ap- proximately 0V to 4.095V (1mV/LSB). The internal reference maintains this output range over time, temperature, and power supply variations (within the values defined in the specifications section). ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION MINIMUM RELATIVE DIFFERENTIAL SPECIFICATION PACKAGE ACCURACY NONLINEARITY TEMPERATURE DRAWING ORDERING TRANSPORT PRODUCT (LSB) (LSB) RANGE PACKAGE NUMBER(1) NUMBER(2) MEDIA DAC7611P ±2 ±1 –40 °C to +85°C 8-Pin DIP 006 DAC7611P Rails DAC7611U ±2 ±1 –40 °C to +85°C 8-Lead SOIC 182 DAC7611U Rails "" " " "" DAC7611U/2K5 Tape and Reel DAC7611PB ±1 ±1 –40 °C to +85°C 8-Pin DIP 006 DAC7611PB Rails DAC7611UB ±1 ±1 –40 °C to +85°C 8-Lead SOIC 182 DAC7611UB Rails "" " " "" DAC7611UB/2K5 Tape and Reel NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “DAC7611/2K5” will get a single 2500-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book. |
同様の部品番号 - DAC7611UG4 |
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同様の説明 - DAC7611UG4 |
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