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AD7801BR データシート(PDF) 3 Page - Analog Devices

部品番号 AD7801BR
部品情報  2.7 V to 5.5 V, Parallel Input, Voltage Output 8-Bit DAC
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

AD7801BR データシート(HTML) 3 Page - Analog Devices

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AD7801
–3–
REV. 0
TIMING CHARACTERISTICS
1, 2
Limit at TMIN, TMAX
Parameter
(B Version)
Units
Conditions/Comments
t1
0
ns min
Chip Select to Write Setup Time
t2
0
ns min
Chip Select to Write Hold Time
t3
20
ns min
Write Pulse Width
t4
15
ns min
Data Setup Time
t5
4.5
ns min
Data Hold Time
t6
20
ns min
Write to
LDAC Setup Time
t7
20
ns min
LDAC Pulse Width
t8
20
ns min
CLR Pulse Width
NOTES
1Sample tested at +25
°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD) and timed from a voltage level of
(VIL + VIH)/2. tr and tf should not exceed 1 µs on any digital input.
2See Figure 1.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7801 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Reference Input Voltage to AGND . . . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
VOUT to AGND . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (B Version) . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 700 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 143
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 870 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 74
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Temperature
Package
Model
Range
Option*
AD7801BR
–40
°C to +105°C
R-20
AD7801BRU
–40
°C to +105°C
RU-20
*R = Small Outline; RU = Thin Shrink Small Outline.
(VDD = +2.7 V to +5.5 V; GND = 0 V; Internal VDD/2 Reference. All specifications TMIN to TMAX
unless otherwise noted.)


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