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TMP121AIDBVTG4 データシート(PDF) 2 Page - Texas Instruments

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部品番号 TMP121AIDBVTG4
部品情報  1.5 C Accurate Digital Temperature Sensor with SPI田?Interface
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メーカー  TI [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI - Texas Instruments

TMP121AIDBVTG4 データシート(HTML) 2 Page - Texas Instruments

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TMP121
TMP123
SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply, V+
7V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage(2)
−0.3V to +7V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Current
10mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range
−55
°C to +150°C
. . . . . . . . . . . . . . .
Storage Temperature Range
−60
°C to +150°C
. . . . . . . . . . . . . . . . .
Junction Temperature (TJ max)
+150
°C
. . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (soldering)
+300
°C
. . . . . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input voltage rating applies to all TMP121 and TMP123 input
voltages.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
TMP121
T121
TMP121
SOT23-6
DBV
T121
TMP123
SOT23-6
DBV
T123
TMP123
SOT23-6
DBV
T123
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATIONS
Top View
SOT23-6
Pin 1 orientation is determined by package marking.
NC
GND
V+
SO
CS
SCK
1
2
3
6
5
4
SOT23−6
NC = No Connection(2)
TMP121(1)
GND
NC
V+
SOT23−6
NC = No Connection(2)
TMP123(1)
SO
CS
SCK
1
2
3
6
5
4
(1) Pin 1 of the SOT23-6 package is determined by orienting the package marking as shown.
(2) Pins labeled NC should be left floating or connected to GND.


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