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LM20BIM7 データシート(PDF) 3 Page - Texas Instruments |
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LM20BIM7 データシート(HTML) 3 Page - Texas Instruments |
3 / 18 page LM20 www.ti.com SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 Connection Diagrams GND (pin 2) may be grounded or left floating. For optimum thermal conductivity to the pc board ground plane, pin 2 must be grounded. NC (pin 1) must be left floating or grounded. Other signal traces must not be connected to this pin. Figure 1. SC70-5 Top View Package Number DCK0005A Pin numbers are referenced to the package marking text orientation. Reference JEDEC Registration MO-211, variation BA The actual physical placement of package marking will vary slightly from part to part. The package marking will designate the date code and will vary considerably. Package marking does not correlate to device type in any way. Figure 2. DSBGA Top View Package Number YZR0004ZZA These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Supply Voltage 6.5V to −0.2V Output Voltage (V+ + 0.6 V) to −0.6 V Output Current 10 mA Input Current at any pin (2) 5 mA Storage Temperature −65°C to 150°C Maximum Junction Temperature (TJMAX) 150°C ESD Susceptibility (3) Human Body Model 2500 V Machine Model 250 V Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.(4) (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V +), the current at that pin should be limited to 5 mA. (3) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. (4) Reflow temperature profiles are different for lead-free and non-lead-free packages. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM20 |
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