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AD9249-65EBZ データシート(PDF) 10 Page - Analog Devices

部品番号 AD9249-65EBZ
部品情報  16 Channel, 14-Bit, 65 MSPS, Serial LVDS, 1.8 V ADC
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

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AD9249
Data Sheet
Rev. 0 | Page 10 of 36
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to GND
−0.3 V to +2.0 V
DRVDD to GND
−0.3 V to +2.0 V
Digital Outputs
(D±x1, D±x2, DCO±1, DCO±2,
FCO±1, FCO±2) to GND
−0.3 V to +2.0 V
CLK+, CLK− to GND
−0.3 V to +2.0 V
VIN±x1, VIN±x2 to GND
−0.3 V to +2.0 V
SCLK/DTP, SDIO/DFS, CSB1, CSB2 to GND
−0.3 V to +2.0 V
SYNC, PDWN to GND
−0.3 V to +2.0 V
RBIAS1, RBIAS2 to GND
−0.3 V to +2.0 V
VREF, VCM1, VCM2, SENSE to GND
−0.3 V to +2.0 V
Environmental
Operating Temperature Range (Ambient)
−40°C to +85°C
Maximum Junction Temperature
150°C
Lead Temperature (Soldering, 10 sec)
300°C
Storage Temperature Range (Ambient)
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Typical θJAis specified for a 4-layer PCB with a solid ground plane.
Airflow improves heat dissipation, which reduces θJA. In addition,
metal in direct contact with the package leads from metal traces,
through holes, ground, and power planes reduces θJA.
Table 7. Thermal Resistance (Simulated)
Package Type
Airflow Velocity
(m/sec)
θJA1, 2
ΨJT1,2
Unit
144-Ball,
10 mm × 10 mm
CSP-BGA
0
30.2
0.13
°C/W
1
Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
ESD CAUTION


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