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LMZ31506RUQR データシート(PDF) 3 Page - Texas Instruments |
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LMZ31506RUQR データシート(HTML) 3 Page - Texas Instruments |
3 / 30 page LMZ31506 www.ti.com SNVS993 – JUNE 2013 THERMAL INFORMATION LMZ31506 THERMAL METRIC(1) RUQ47 UNIT 47 PINS θJA Junction-to-ambient thermal resistance(2) 13 θJCtop Junction-to-case (top) thermal resistance (3) 9 θJCbot Junction-to-case (bottom) thermal resistance (4) 3.8 °C/W θJB Junction-to-board thermal resistance (5) 6 ψJT Junction-to-top characterization parameter(6) 2.5 ψJB Junction-to-board characterization parameter(7) 5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with 1 oz. copper and natural convection cooling. Additional airflow reduces θJA. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (6) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device. (7) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device. PACKAGE SPECIFICATIONS LMZ31506 UNIT Weight 1.26 grams Flammability Meets UL 94 V-O MTBF Calculated reliability Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign 33.9 MHrs Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LMZ31506 |
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