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STPS20200CFP データシート(PDF) 6 Page - STMicroelectronics |
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STPS20200CFP データシート(HTML) 6 Page - STMicroelectronics |
6 / 15 page Package information STPS20200C 6/15 DocID024382 Rev 2 2 Package information • Epoxy meets UL94, V0 • Lead-free package • Cooling method: by conduction (C) • Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8. TO-220AB dimension definitions A F D1 J1 H1 ∅P Q D L1 L b E e1 e L20 L30 b1 c Resin gate 0.5 mm max. protrusion(1) Resin gate 0.5 mm max. protrusion(1) (1) Resin gate position accepted in each of the two position shown as well as the symmetrical opposites |
同様の部品番号 - STPS20200CFP |
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同様の説明 - STPS20200CFP |
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