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AM29LV800BB70RSE データシート(PDF) 6 Page - Advanced Micro Devices |
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AM29LV800BB70RSE データシート(HTML) 6 Page - Advanced Micro Devices |
6 / 42 page 6 Am29LV800B P R E L I M I NARY Special Handling Instructions for FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. T he pac k age an d/ or data int egr ity ma y be compromised if the package body is exposed to temperatures above 150 °C for prolonged periods of time. PIN CONFIGURATION A0–A18 = 19 addresses DQ0–DQ14 = 15 data inputs/outputs DQ15/A-1 = DQ15 (data input/output, word mode), A-1 (LSB address input, byte mode) BYTE# = Selects 8-bit or 16-bit mode CE# = Chip enable OE# = Output enable WE# = Write enable RESET# = Hardware reset pin, active low RY/BY# = Ready/Busy# output VCC = 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) VSS = Device ground NC = Pin not connected internally LOGIC SYMBOL 21490E-4 19 16 or 8 DQ0–DQ15 (A-1) A0–A18 CE# OE# WE# RESET# BYTE# RY/BY# |
同様の部品番号 - AM29LV800BB70RSE |
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同様の説明 - AM29LV800BB70RSE |
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