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LM2671MX-ADJ データシート(PDF) 5 Page - Texas Instruments |
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LM2671MX-ADJ データシート(HTML) 5 Page - Texas Instruments |
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5 / 31 page  LM2671 www.ti.com SNVS008K – SEPTEMBER 1998 – REVISED APRIL 2013 All Output Voltage Versions Specifications with standard type face are for TJ = 25°C, and those in bold type face apply over full Operating Temperature Range. Unless otherwise specified, VIN = 12V for the 3.3V, 5V, and Adjustable versions and VIN = 24V for the 12V version, and ILOAD = 100 mA. Symbol Parameters Conditions Typ Min Max Units DEVICE PARAMETERS IQ Quiescent Current VFEEDBACK = 8V 2.5 3.6 mA For 3.3V, 5.0V, and ADJ Versions VFEEDBACK = 15V 2.5 mA For 12V Versions ISTBY Standby Quiescent Current ON/OFF Pin = 0V 50 100/150 μA ICL Current Limit 0.8 0.62/0.575 1.2/1.25 A IL Output Leakage Current VIN = 40V, ON/OFF Pin = 0V 1 25 μA VSWITCH = 0V VSWITCH = −1V, ON/OFF Pin = 0V 6 15 mA RDS(ON) Switch On-Resistance ISWITCH = 500 mA 0.25 0.40/0.60 Ω fO Oscillator Frequency Measured at Switch Pin 260 225 275 kHz D Maximum Duty Cycle 95 % Minimum Duty Cycle 0 % IBIAS Feedback Bias Current VFEEDBACK = 1.3V ADJ Version Only 85 nA VS/D ON/OFF Pin Voltage Thesholds 1.4 0.8 2.0 V IS/D ON/OFF Pin Current ON/OFF Pin = 0V 20 7 37 μA FSYNC Synchronization Frequency VSYNC = 3.5V, 50% duty cycle 400 kHz VSYNC Synchronization Threshold 1.4 V Voltage VSS Soft-Start Voltage 0.63 0.53 0.73 V ISS Soft-Start Current 4.5 1.5 6.9 μA θJA Thermal Resistance P Package, Junction to Ambient (1) 95 °C/W D Package, Junction to Ambient (1) 105 (1) Junction to ambient thermal resistance with approximately 1 square inch of printed circuit board copper surrounding the leads. Additional copper area will lower thermal resistance further. See Application Information section in the application note accompanying this datasheet and the thermal model in LM267X Made Simple version 6.0 software. The value θJ−A for the WSON (NHN) package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 SNOA401. Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM2671 |
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