データシートサーチシステム |
|
LMR14206XMK データシート(PDF) 4 Page - Texas Instruments |
|
LMR14206XMK データシート(HTML) 4 Page - Texas Instruments |
4 / 17 page LMR14206 SNVS733D – OCTOBER 2011 – REVISED APRIL 2013 www.ti.com Electrical Characteristics Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12V. Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units IQ Quiescent current SHDN = 0V 16 40 µA Device On, Not Switching 1.30 1.75 mA Device On, No Load 1.35 1.85 RDSON Switch ON resistance See (3) 0.9 1.6 Ω ILSW Switch leakage current VIN = 42V 0.0 0.5 µA ICL Switch current limit See (4) 1.15 A IFB Feedback pin bias current See (5) 0.1 1.0 µA VFB FB Pin reference voltage 0.747 0.765 0.782 V tMIN Minimum ON time 100 ns fSW VFB = 0.5V 0.95 1.25 1.50 Switching frequency MHz VFB = 0V 0.35 DMAX Maximum duty cycle 81 87 % VUVP Undervoltage lockout On threshold 4.4 3.7 V thresholds Off threshold 3.5 3.25 VSHDN Shutdown threshold Device on 2.3 1.0 V Device off 0.9 0.3 ISHDN Shutdown pin input bias current VSHDN = 2.3V (5) 0.05 1.5 µA VSHDN = 0V 0.02 1.5 THERMAL SPECIFICATIONS RθJA Junction-to-Ambient Thermal See (6) 121 °C/W Resistance, SOT Package (1) All limits specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). (2) Typical numbers are at 25°C and represent the most likely norm. (3) Includes the bond wires, RDSON from VIN pin to SW pin. (4) Current limit at 0% duty cycle. (5) Bias currents flow into pin. (6) All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards. Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, number of thermal vias, board size, ambient temperature, and air flow. 4 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LMR14206 |
同様の部品番号 - LMR14206XMK |
|
同様の説明 - LMR14206XMK |
|
|
リンク URL |
プライバシーポリシー |
ALLDATASHEET.JP |
ALLDATASHEETはお客様のビジネスに役立ちますか? [ DONATE ] |
Alldatasheetは | 広告 | お問い合わせ | プライバシーポリシー | リンク交換 | メーカーリスト All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |