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LM3940 データシート(PDF) 3 Page - Texas Instruments |
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LM3940 データシート(HTML) 3 Page - Texas Instruments |
3 / 18 page LM3940 www.ti.com SNVS114E – MAY 1999 – REVISED MARCH 2013 ELECTRICAL CHARACTERISTICS Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range. Unless otherwise specified: VIN = 5V, IL = 1A, COUT = 33 μF. Symbol Parameter Conditions Typical LM3940 (1) Units min max 3.20 3.40 VO Output Voltage 5 mA ≤ IL ≤ 1A 3.3 V 3.13 3.47 IL = 5 mA Line Regulation 20 40 4.5V ≤ VIN ≤ 5.5V (1) mV 50 Load Regulation 50 mA ≤ IL ≤ 1A 35 80 (2) IL (DC) = 100 mA ZO Output Impedance IL (AC) = 20 mA (rms) 35 m Ω f = 120 Hz 4.5V ≤ VIN ≤ 5.5V 15 10 IL = 5 mA 20 IQ Quiescent Current mA VIN = 5V 200 110 IL = 1A 250 BW = 10 Hz–100 kHz en Output Noise Voltage 150 μV (rms) IL = 5 mA 0.8 IL = 1A 0.5 V 1.0 Dropout Voltage VDO (2) 150 IL = 100 mA 110 mV 200 IL(SC) Short Circuit Current RL = 0 1.7 1.2 A (1) All limits specified for TJ = 25°C are 100% tested and are used to calculate Outgoing Quality Levels. All limits at temperature extremes are verified via correlation using standard Statistical Quality Control (SQC) methods. (2) Dropout voltage is defined as the input-output differential voltage where the regulator output drops to a value that is 100 mV below the value that is measured at VIN = 5V. THERMAL PERFORMANCE 3-Lead TO-220 4 °C/W Thermal Resistance, Junction-to-Case, θJC 3-Lead DDPAK/TO-263 4 °C/W 8-Lead WSON 6 °C/W 3-Lead TO-220 60 °C/W Thermal Resistance, Junction-to-Ambient, θJA 3-Lead DDPAK/TO-263 80 °C/W 8-Lead WSON (1) 35 °C/W (1) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ, the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. The value of θJA (for devices in still air with no heatsink) is 60°C/W for the TO-220 package, 80°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. The effective value of θJA can be reduced by using a heatsink (see APPLICATION HINTS for specific information on heatsinking). The value of θJA for the WSON package is specifically dependant on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 SNOA401. The θJA rating for the WSON is with a JESD51-7 test board having 6 thermal vias under the exposed pad. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3940 |
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