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BD81A34MUV-M データシート(PDF) 25 Page - Rohm |
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BD81A34MUV-M データシート(HTML) 25 Page - Rohm |
25 / 36 page 25/33 Datasheet Datasheet BD81A34MUV-M BD81A34EFV-M TSZ02201-0G3G0C600020-1-2 © 2014 ROHM Co., Ltd. All rights reserved. 16.Jan.2014 Rev.002 www.rohm.com TSZ22111 ・15・001 Attention Point for PCB Layout The layout pattern influences characteristic, such as efficiency and a ripple greatly. So, it is necessary to examine carefully about it. Boost DC/DC has “Loop1” (in Figure 30). Placement of these parts should be compact. And wiring should be low-impedance (e.g. Cout’s GND and DGND should be very near). Also, Back-Boost DC/DC has “Loop2”. Placement of these parts and wiring should be compact and low-impedance (e.g. Cin’s GND and D1’s GND should be very near). Figure 30. BD81A34EFV PCB TOP-layer Figure 29. circuit of DC/DC block VIN Rcs L D2 OUTL M1 Vout CS SW OUTH BD81A14EFV D1 Cout Cin <Loop1> <Loop2> DGND M2 D1 Cin Cout <Loop1> <Loop2> D2 Rcs M1 M2 |
同様の部品番号 - BD81A34MUV-M |
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同様の説明 - BD81A34MUV-M |
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