データシートサーチシステム |
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LMH6553SDNOPB データシート(PDF) 2 Page - National Semiconductor (TI) |
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LMH6553SDNOPB データシート(HTML) 2 Page - National Semiconductor (TI) |
2 / 39 page LMH6553 SNOSB07H – SEPTEMBER 2008 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) ESD Tolerance (3) Human Body Model 4000V Machine Model 350V Supply Voltage 13.2V Common Mode Input Voltage ±VS Maximum Input Current (pins 1, 2, 7, 8) 30 mA Maximum Output Current (pins 4, 5) (4) Maximum Junction Temperature 150°C For soldering specifications see product folder at http://www.ti.com and http://www.ti.com/lit/SNOA549 (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical Characteristics tables. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 30157. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (4) The maximum output current (IOUT) is determined by device power dissipation limitations. See POWER DISSIPATION of Application Information for more details. Operating Ratings (1) Operating Temperature Range (2) −40°C to +125°C Storage Temperature Range −65°C to +150°C Total Supply Voltage 4.5V to 12V Package Thermal Resistance ( θJA) 8-Pin SO PowerPAD 59°C/W 8-Pin WSON 58°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical Characteristics tables. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)– TA) / θJA. All numbers apply for packages soldered directly onto a PC Board. 2 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: LMH6553 |
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