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LMH6639MFNOPB データシート(PDF) 2 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部品番号 LMH6639MFNOPB
部品情報  LMH6639 190MHz Rail-to-Rail Output Amplifier with Disable
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メーカー  NSC [National Semiconductor (TI)]
ホームページ  http://www.national.com
Logo NSC - National Semiconductor (TI)

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LMH6639
SNOS989G – JANUARY 2002 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
ESD Tolerance
2KV(3)
200V(4)
VIN Differential
±2.5V
Input Current
±10mA
Supply Voltage (V+ – V)
13.5V
Voltage at Input/Output pins
V+ +0.8V, V
−0.8V
Storage Temperature Range
−65°C to +150°C
Junction Temperature(5)(6)
+150°C
Soldering Information
Infrared or Convection (20 sec)
235°C
Wave Soldering (10 sec)
260°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
Human body model, 1.5k
Ω in series with 100pF.
(4)
Machine Model, 0
Ω in series with 200pF.
(5)
The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
(6)
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
Operating Ratings
(1)
Supply Voltage (V+ to V)
3V to 12V
Operating Temperature Range(2)
−40°C to +85°C
Package Thermal Resistance (
θJA)
(2)
SOT-23-6
265°C/W
SOIC-8
190°C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2)
The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
3V Electrical Characteristics
Unless otherwise specified, all limits ensured for at TJ = 25°C, V
+ = 3V, V= 0V, V
O = VCM = V
+/2, and R
L = 2kΩ to V
+/2.
Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
Min(1)
Typ(2)
Max(1)
Units
BW
−3dB BW
AV = +1
120
170
MHz
AV = −1
63
BW0.1dB
0.1dB Gain Flatness
RF = 2.65kΩ , RL = 1kΩ,
16.4
MHz
FPBW
Full Power Bandwidth
AV = +1, VOUT = 2VPP, −1dB
21
MHz
V+ = 1.8V, V= 1.2V
GBW
Gain Bandwidth product
AV = +1
83
MHz
en
Input-Referred Voltage Noise
RF = 33kΩ
f = 10kHz
19
nV/
√Hz
f = 1MHz
16
in
Input-Referred Current Noise
RF = 1MΩ
f = 10kHz
1.30
pA/
√Hz
f = 1MHz
0.36
THD
Total Harmonic Distortion
f = 5MHz, VO = 2VPP, AV = +2,
−50
dBc
RL = 1kΩ to V
+/2
(1)
All limits are ensured by testing or statistical analysis.
(2)
Typical values represent the most likely parametric norm.
2
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Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6639


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