データシートサーチシステム |
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CS464 データシート(PDF) 4 Page - Cherry Semiconductor Corporation |
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CS464 データシート(HTML) 4 Page - Cherry Semiconductor Corporation |
4 / 4 page 4 Package Specification .525 ± .05 .0302 MAX 13X .095 ± .045 13X .165 ± .038 1.022 CA MB CR .496 2.39 .356 .431 1.021 1.020 1.022 .279 .382 1.017 2.14 0 0 0 0 CS-464 ÊFlip-ChipÊ CS S OUT IC D VCC Gnd IN- IN+ Test Note: All dimensions in millimeters. Flip-Chip Rev. 3/1/99 © 1999 Cherry Semiconductor Corporation PACKAGE DIMENSIONS IN mm (INCHES) Ordering Information Part Number Description CS464 Flip-Chip CS464YDW16 16 Lead SO Wide CS464YDWR16 16 Lead SO Wide (tape & reel) PACKAGE THERMAL DATA D Lead Count Metric English Max Min Max Min 16 Lead SO Wide 10.50 10.10 .413 .398 Thermal Data 16 Lead SO Wide RQJC typ 23 ûC/W RQJA typ 105 ûC/W Bump Locations, Bump Side Up Cherry Semiconductor Corporation reserves the right to make changes to the specifications without notice. Please contact Cherry Semiconductor Corporation for the latest available information. Surface Mount Wide Body (DW); 300 mil wide 1.27 (.050) BSC 7.60 (.299) 7.40 (.291) 10.65 (.419) 10.00 (.394) D 0.32 (.013) 0.23 (.009) 1.27 (.050) 0.40 (.016) REF: JEDEC MS-013 2.49 (.098) 2.24 (.088) 0.51 (.020) 0.33 (.013) 2.65 (.104) 2.35 (.093) 0.30 (.012) 0.10 (.004) |
同様の部品番号 - CS464 |
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同様の説明 - CS464 |
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