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BTB5839M3 データシート(PDF) 7 Page - Cystech Electonics Corp. |
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BTB5839M3 データシート(HTML) 7 Page - Cystech Electonics Corp. |
7 / 8 page CYStech Electronics Corp. Spec. No. : C240M3 Issued Date : 2012.10.18 Revised Date : 2013.08.07 Page No. : 7/8 BTB5839M3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 5 +1/-1 seconds 260 +0/-5 °C Recommended temperature profile for IR reflow Pb-free Assembly Profile feature Sn-Pb eutectic Assembly Average ramp-up rate 3 °C/second max. 3 °C/second max. (Tsmax to Tp) Preheat 100 °C 150 °C −Temperature Min(TS min) −Temperature Max(TS max) 150 °C 200 °C −Time(ts min to ts max) 60-120 seconds 60-180 seconds Time maintained above: −Temperature (TL) 183 °C 217 °C − Time (tL) 60-150 seconds 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5 °C of actual peak 10-30 seconds 20-40 seconds temperature(tp) Ramp down rate 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Time 25 °C to peak temperature Note : All temperatures refer to topside of the package, measured on the package body surface. |
同様の部品番号 - BTB5839M3 |
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同様の説明 - BTB5839M3 |
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