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SML-L13DTAFS データシート(PDF) 9 Page - Rohm |
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SML-L13DTAFS データシート(HTML) 9 Page - Rohm |
9 / 10 page PRODUCTS Surface Mount Chip LED TYPE SML-L13DTAFS PAGE / 【ATTENTION POINT IN HANDLING】 This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 1.DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1. The size and direction of the pad pattern depends on the condition of the PCB, So, please investigate about the adjustment thoroughly before designing. 2.SOLDERING ( Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu ) LED products do not contain reinforcement materials such as glass fillers. Therefore, thermal stress by soldering greatly influence its reliability. The temperature conditions for reflow soldering should therefore be set up according to the characteristic of this product. (See Fig-2) Furthermore, a sudden heating or cooling of LED cause internal stress greatly and has a possibility to break the device. Therefore, thermal gradient shall be gradual as possible. Number of reflow process shall be max 2 times and these processes shall be performed in a row. Cooling process to normal temperature shall be required between first and second soldering process. 3.HANDLING AFTER MOUNTING In case outside force is given to the device, stress is concentrated to the jointed part between mold resin and substrate. Therefore please be careful when handling LED and PCB for there is a possibility to break the device or PCB. 4.WASHING Please note the following points when washing is required after soldering. 4-1) WASHING SOLVENT Isopropyl alcohol or other alcohol solvent is recommendable. 4-2) TEMPERATURE Below 30℃, immersion time ; within 3 minutes. 4-3) ULTRA SONIC WASHING Below 15 / 1 litter of solvent tub. 4-4) CULING Below 100℃ within 3 minutes. 5.STORAGE At reflow soldering, the reliability of this product is often influenced by moisture absorption so we apply the packaging with moisture proof for better condition is use, please also note that 5-1) Not to be opened before using. 5-2) To be kept in our moisture proof packaging with some desiccant (SILICA GEL) after opening it. To be baked in case the SILICAGEL indicator changed its color from either blue to clear or green to pink. 5-3) Please use within 72 hours after the package was opened. (Condition at 30℃, max.70%Rh.) In case it is not used within 72 hours, please put it back into our packaging. 5-4) BAKING Please bake under reel condition at 60℃, 12~24 hours (max.20%Rh) after un-sealing. While baking is done, the reel and emboss tape may be easily deformed. Please be careful not to give any stress. REV.: - SPECIFICATION No.: TENTATIVE (20091222) TSZ22111・05・002 ( Fig-1) ( unit : mm ) 0 50 100 150 200 250 300 Outside Force PCB Soldering part Emitting Direction 1.2±0.1 0.5 0.8 0.8 0.5 Through hole (Fig-2) Max 250℃, Within 10sec 140~180℃ 230~250℃ Max 40sec Min.1 min Max -6℃/sec |
同様の部品番号 - SML-L13DTAFS |
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同様の説明 - SML-L13DTAFS |
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