1

2

3

4

7

8

9

10

5

6

11

12

13

14

15

16

*

*

*

*

FB

*

*

GND

GND

ON/OFF

* No Connections

*

*

DAP

**

**Connect to Pins 11, 12 on PCB

LM2675

SNVS129E – MAY 2004 – REVISED JUNE 2005

www.ti.com

Typical Application

Connection Diagram

16-Lead LLP Surface Mount Package

Top View

Figure 1. LLP Package

8-Lead Package

Top View

Figure 2. SO-8/DIP Package

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

Submit Documentation Feedback

Copyright © 2004–2005, Texas Instruments Incorporated

Product Folder Links: LM2675