1

2

3

4

6

5

EN

FB

SW

DAP

VINA

VIND

GND

VIN

SW

2

1

3

5

4

EN

FB

GND

LM2831

SNVS422B – AUGUST 2006 – REVISED JANUARY 2012

www.ti.com

Connection Diagrams

Figure 1. 6-Pin WSON

Figure 2. 5-Pin SOT-23

See Package Number NGG

See Package Number DBV

PIN DESCRIPTIONS (5-PIN SOT-23)

Pin

Name

Function

1

SW

Output switch. Connect to the inductor and catch diode.

2

GND

Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible

to this pin.

3

FB

Feedback pin. Connect to external resistor divider to set output voltage.

4

EN

Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VIN

+ 0.3V.

5

VIN

Input supply voltage.

PIN DESCRIPTIONS (6-PIN WSON)

Pin

Name

Function

1

FB

Feedback pin. Connect to external resistor divider to set output voltage.

2

GND

Signal and power ground pin. Place the bottom resistor of the feedback network as close as

possible to this pin.

3

SW

Output switch. Connect to the inductor and catch diode.

4

VIND

Power Input supply.

5

VINA

Control circuitry supply voltage. Connect VINA to VIND on PC board.

6

EN

Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than

VINA + 0.3V.

DAP

Die Attach Pad

Connect to system ground for low thermal impedance, but it cannot be used as a primary GND

connection.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

VIN

-0.5V to 7V

FB Voltage

-0.5V to 3V

EN Voltage

-0.5V to 7V

SW Voltage

-0.5V to 7V

ESD Susceptibility

2kV

150°C

Storage Temperature

−65°C to +150°C

Soldering Information

Infrared or Convection Reflow (15 sec)

220°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Range indicates conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.

2

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