LM3405A_14 datasheet(3/31 Pages) TI1

部品番号	LM3405A

部品情報	1.6MHz, 1A Constant Current Buck LED Driver with Internal Compensation in Tiny SOT and MSOP PowerPAD Packages

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LM3405A

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SNVS508B – OCTOBER 2007 – REVISED OCTOBER 2008

ABSOLUTE MAXIMUM RATINGS

(1)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability

and specifications.

VALUE / UNIT

VIN

-0.5V to 24V

SW Voltage

-0.5V to 24V

Boost Voltage

-0.5V to 30V

Boost to SW Voltage

-0.5V to 6.0V

FB Voltage

-0.5V to 3.0V

EN/DIM Voltage

-0.5V to (VIN + 0.3V)

Junction Temperature

150°C

ESD Susceptibility (2)

2kV

Storage Temperature

-65°C to +150°C

Soldering Information Infrared/Convection Reflow (15sec)

220°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings define the conditions under

which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.

(2)

Human body model, 1.5k

Ω in series with 100pF.

RECOMMENDED OPERATING CONDITIONS

(1)

VALUE / UNIT

VIN

3V to 22V

EN/DIM voltage

-0.5V to (VIN + 0.3V)

Boost to SW Voltage

2.5V to 5.5V

Junction Temperature Range

-40°C to +125°C

Thermal Resistance

θJA

(2)

SOT 118°C/W

Thermal Resistance

θJA

(3)

eMSOP8 73°C/W

ILED SOT package

400mA

ILED MSOP PowerPAD package

1A

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings define the conditions under

which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.

(2)

Thermal shutdown will occur if the junction temperature (TJ) exceeds 165°C. The maximum allowable power dissipation (PD) at any

ambient temperature (TA) is PD = (TJ(MAX) – TA)/θJA . This number applies to packages soldered directly onto a 3" x 3" PC board with

2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still air,

θJA = 204°C/W.

(3)

Thermal shutdown will occur if the junction temperature (TJ) exceeds 165°C. The maximum allowable power dissipation (PD) at any

ambient temperature (TA) is PD = (TJ(MAX) – TA)/θJA . This number applies to packages soldered directly onto a 1" x 0.75" PC board with

1oz. copper on 4 layers in still air.

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