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LM3421 データシート(PDF) 7 Page - Texas Instruments |
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LM3421 データシート(HTML) 7 Page - Texas Instruments |
7 / 65 page LM3421, LM3421-Q1 LM3423, LM3423-Q1 www.ti.com SNVS574D – JULY 2008 – REVISED SEPTEMBER 2011 Electrical Characteristics (1) (continued) Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +150°C for LM3421Q0/LM3423Q0, TJ = −40°C to +125°C for all others). Specifications that differ between the two operating ranges will be identified in the Temp Range column as Q0 for TJ = −40°C to +150°C and as Q1 for TJ = −40°C to +125°C. If no temperature range is indicated then the specification holds for both Q1 and Q0. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only. Unless otherwise stated the following condition applies: VIN = +14V. Temp Symbol Parameter Conditions Min(2) Typ(3) Max(2) Units Range PULL-DOWN N-CHANNEL MosFETS RRPD RPD Pull-down Resistance Q1 300 145 Q0 350 RFLT FLT Pull-down Resistance Q1 300 145 Ω Q0 350 RLRDY LRDY Pull-down Resistance Q1 300 135 Q0 350 THERMAL SHUTDOWN TSD Thermal Shutdown Threshold (4) Q1 165 Q0 210 °C THYS Thermal Shutdown Hysteresis (4) 25 THERMAL RESISTANCE θJA Junction to Ambient (5) 16L TSSOP 37.4 °C/W 20L TSSOP 34.0 θJC Junction to Exposed Pad (EP) 16L TSSOP 2.3 °C/W 20L TSSOP 2.3 (5) Junction-to-ambient thermal resistance is highly board-layout dependent. The numbers listed in the table are given for an reference layout wherein the 16L TSSOP package has its EP pad populated with 9 vias and the 20L TSSOP has its EP pad populated with 12 vias. In applications where high maximum power dissipation exists, namely driving a large MosFET at high switching frequency from a high input voltage, special care must be paid to thermal dissipation issues during board design. In high-power dissipation applications, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C for Q1, or 150°C for Q0), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). In most applications there is little need for the full power dissipation capability of this advanced package. Under these circumstances, no vias would be required and the thermal resistances would be 104 °C/W for the 16L TSSOP and 86.7 °C/W for the 20L TSSOP. It is possible to conservatively interpolate between the full via count thermal resistance and the no via count thermal resistance with a straight line to get a thermal resistance for any number of vias in between these two limits. Copyright © 2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: LM3421 LM3421-Q1 LM3423 LM3423-Q1 |
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