データシートサーチシステム |
|
CA3252M データシート(PDF) 1 Page - Intersil Corporation |
|
CA3252M データシート(HTML) 1 Page - Intersil Corporation |
1 / 6 page 1 March 1998 CA3252 Quad Gated Non-Inverting Power Driver Features • Four 600mA Non-Inverting Power Output Drivers • 50V and 1A Maximum Rated Power Output Drivers •VCE(SUS) Capability . . . . . . . . . . . . . . . . . . . . . . . . . 35V • Inputs Compatible With TTL or 5V CMOS Logic • Suitable For Resistive, Lamp or Inductive Loads • Inductive Clamps on Each Output • High Dissipation Power-Frame Package • Operating Temperature Ranges . . . . . . -40oC to 105oC Applications • Solenoids • Relays • Lamps • Steppers • Small Motors • Displays System Applications • Automotive • Appliances • Industrial Controls • Robotics Description The CA3252 is used to interface low-level logic to high cur- rent loads. Each Power Driver has four inverting switches consisting of an inverting logic input stage and an inverting low-side driver output stage. All inputs are 5V TTL/CMOS logic compatible and have a common Enable input. On-chip steering diodes are connected from each output (in pairs) to the CLAMP pins (in pairs) which may be used in conjunction with external zener diodes to protect the IC against over-volt- age transients that result from inductive load switching. The CA3252 may be used in a variety of automotive and indus- trial control applications to drive relays, solenoids, lamps and small motors. To allow for maximum heat transfer from the chip, all ground pins on the DIP and SOIC packages are directly connected to the mounting pad of the chip. Integral heat spreading lead frames directly connect the bond pad and ground leads for good heat dissipation. In a typical application, the package is mounted on a copper PC Board. By increasing copper ground area on the PC Board, more heat is conducted away from the ground leads. The junction-to-ambient thermal resistances may be reduced to less than 40oC/W with approximately two square inches of copper area. Pinouts CA3252E (PDIP) TOP VIEW CA3252M (SOIC) TOP VIEW Ordering Information PART NUMBER TEMP. (oC) PACKAGE PKG. NO. CA3252E -40 to 105 16 Ld PDIP E16.3 CA3252M -40 to 105 20 Ld SOIC M20.3 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 OUT A CLAMP AB OUT B GND GND OUT C CLAMP CD OUT D IN A IN B ENABLE GND GND VCC IN C IN D 11 12 13 14 15 16 17 18 20 19 10 9 8 7 6 5 4 3 2 1 CLAMP AB NC NC OUT B GND GND NC OUT C NC CLAMP CD OUT A INB ENABLE GND IN A GND VCC IN C IN D OUT D File Number 1542.2 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 |
同様の部品番号 - CA3252M |
|
同様の説明 - CA3252M |
|
|
リンク URL |
プライバシーポリシー |
ALLDATASHEET.JP |
ALLDATASHEETはお客様のビジネスに役立ちますか? [ DONATE ] |
Alldatasheetは | 広告 | お問い合わせ | プライバシーポリシー | リンク交換 | メーカーリスト All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |