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CD4063 データシート(PDF) 8 Page - Intersil Corporation |
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CD4063 データシート(HTML) 8 Page - Intersil Corporation |
8 / 8 page 965 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com CD4063BMS Chip Dimensions and Pad Layout Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches FIGURE 9. TYPICAL TRANSITION TIME vs LOAD CAPACITANCE FIGURE 10. TYPICAL POWER DISSIPATION vs FREQUENCY Typical Performance Characteristics (Continued) AMBIENT TEMPERATURE (TA) = +25 oC LOAD CAPACITANCE (CL) (pF) 0 40 60 80 100 20 0 50 100 150 200 SUPPLY VOLTAGE (VDD) = 5V 10V 15V 8 6 4 28 6 4 22 INPUT FREQUENCY (f) (kHz) 0.1 1 10 102 103 8 6 4 28 6 4 6 4 2 6 4 2 6 4 2 6 4 2 103 102 10 1 104 AMBIENT TEMPERATURE (TA) = +25 oC SUPPLY VOLTAGE (VDD) = 15V LOAD CAPACITANCE (CL) = 50pF 5V, 50pF 10V, 50pF 10V, 15pF 28 6 4 |
同様の部品番号 - CD4063 |
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同様の説明 - CD4063 |
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