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BD1HC500EFJ-C データシート(PDF) 3 Page - Rohm |
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BD1HC500EFJ-C データシート(HTML) 3 Page - Rohm |
3 / 21 page Datasheet Datasheet 3/18 BD1Hx500 Series TSZ02201-0G3G0BD00070-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002 www.rohm.com TSZ22111・15・001 Absolute Maximum Ratings Parameter Symbol Rating Unit Voltage between drain and source VDS 44.5 (Internal limitation) V Power supply voltage VDD 40 V Input voltage VIN -0.3 to +12 (1) V Diagnostic output voltage VST -0.3 to +15 (1) V Output current (DC) IOD 0.8 (2) A Output current (Pulse) IOP Internal limitation (3) A Diagnostic output current IST 1 mA Power Consumption Pd 2.100 (HTSOP-J8) (4) 1.750(HSON 8) (5) W 0.587 (MSOP 8) (6) Operating temperature range Topr -40 ≤ Topr < +150 °C Storage temperature range Tstg -55 to +150 °C Maximum junction temperature Tjmax 150 °C Active clamp energy (single pulse) EAV 33 mJ Operating Voltage Ratings Parameter Symbol Rating Unit Operating voltage VDD 4 to 18 V (1) However, VDD ≥ VIN (2) However, exceed neither Pd nor ASO. (3) Because of overcurrent protection circuit. (Refer to P11 Figure 20) (4) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board). Derate by 16.8mW above 25°C (5) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board). Derate by 14.0mW above 25°C (6) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 1 layer board). Derate by 4.7mW above 25°C. Heat Dissipation Characteristic (HTSOP-J8) (1)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 4 layer board). Derate by 30mW/°C above 25°C. (2)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board). Derate by 16.8mW/°C above 25°C. (HSON 8) (3)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board). Derate by 14.0mW/°C above 25°C. (MSOP 8) (4)IC mounted on ROHM standard board (70×70×1.6[mm],copper area 70×70[mm], glass epoxy 1 layer board). Derate by 4.7mW/°C above 25°C. 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 0 25 50 75 100 125 150 Ta [°C] 0.587 W 2.100 W 3.750 W (1) HTSOP-J8 (2) HTSOP-J8 (4) MSOP8 1.750 W (3) HSON8 (1) HTSOP-J8(glass epoxy 4 layer board) (2) HTSOP-J8(glass epoxy 2 layer board) (3) HSON8 (glass epoxy 2 layer board) (4) MSOP8 (glass epoxy 1 layer board) |
同様の部品番号 - BD1HC500EFJ-C |
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同様の説明 - BD1HC500EFJ-C |
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