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IRF1324PBF データシート(PDF) 2 Page - International Rectifier

部品番号 IRF1324PBF
部品情報  High Efficiency Synchronous Rectification in SMPS
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メーカー  IRF [International Rectifier]
ホームページ  http://www.irf.com
Logo IRF - International Rectifier

IRF1324PBF データシート(HTML) 2 Page - International Rectifier

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IRF1324PbF
2
www.irf.com
S
D
G
… Pulse width ≤ 400µs; duty cycle ≤ 2%.
† Coss eff. (TR) is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS.
‡ Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS.
ˆ Rθ is measured at TJ approximately 90°C
Notes:
 Calcuted continuous current based on maximum allowable junction
temperature Bond wire current limit is 195A. Note that current
limitation arising from heating of the device leds may occur with
some lead mounting arrangements.
‚ Repetitive rating; pulse width limited by max. junction
temperature.
ƒ Limited by TJmax, starting TJ = 25°C, L = 0.014mH
RG = 25Ω, IAS = 195A, VGS =10V. Part not recommended for use
above this value .
„ ISD ≤ 195A, di/dt ≤ 450 A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.
Static @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
V(BR)DSS
Drain-to-Source Breakdown Voltage
24
–––
–––
V
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
–––
22
––– mV/°C
RDS(on)
Static Drain-to-Source On-Resistance
–––
1.2
1.5
m
VGS(th)
Gate Threshold Voltage
2.0
–––
4.0
V
IDSS
Drain-to-Source Leakage Current
–––
–––
20
µA
–––
–––
250
IGSS
Gate-to-Source Forward Leakage
–––
–––
200
nA
Gate-to-Source Reverse Leakage
–––
–––
-200
RG
Internal Gate Resistance
–––
2.3
–––
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
gfs
Forward Transconductance
180
–––
–––
S
Qg
Total Gate Charge
–––
160
240
Qgs
Gate-to-Source Charge
–––
84
–––
Qgd
Gate-to-Drain ("Miller") Charge
–––
49
–––
Qsync
Total Gate Charge Sync. (Qg - Qgd)
–––
76
–––
td(on)
Turn-On Delay Time
–––
17
–––
tr
Rise Time
–––
190
–––
td(off)
Turn-Off Delay Time
–––
83
–––
tf
Fall Time
–––
120
–––
Ciss
Input Capacitance
–––
7590
–––
Coss
Output Capacitance
–––
3440
–––
Crss
Reverse Transfer Capacitance
–––
1960
–––
Coss eff. (ER) Effective Output Capacitance (Energy Related) ––– 4700 –––
Coss eff. (TR) Effective Output Capacitance (Time Related)
–––
4490
–––
Diode Characteristics
Symbol
Parameter
Min. Typ. Max. Units
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)
Ãd
VSD
Diode Forward Voltage
–––
–––
1.3
V
trr
Reverse Recovery Time
–––
46
–––
TJ = 25°C
VR = 20V,
–––
71
–––
TJ = 125°C
IF = 195A
Qrr
Reverse Recovery Charge
–––
160
–––
TJ = 25°C
di/dt = 100A/µs
g
–––
430
–––
TJ = 125°C
IRRM
Reverse Recovery Current
–––
7.7
–––
A
TJ = 25°C
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
ns
nC
nC
ns
pF
A
353™
1412
–––
–––
–––
–––
ID = 195A
RG = 2.7Ω
VGS = 10V g
VDD = 16V
ID = 195A, VDS =0V, VGS = 10V
TJ = 25°C, IS = 195A, VGS = 0V g
integral reverse
p-n junction diode.
Conditions
VGS = 0V, ID = 250µA
Reference to 25°C, ID = 5.0mAd
VGS = 10V, ID = 195A g
VDS = VGS, ID = 250µA
VDS = 24V, VGS = 0V
VDS = 24V, VGS = 0V, TJ = 125°C
MOSFET symbol
showing the
VDS = 12V
Conditions
VGS = 10V g
VGS = 0V
VDS = 24V
ƒ = 1.0 MHz, See Fig. 5
VGS = 0V, VDS = 0V to 19V i, See Fig. 11
VGS = 0V, VDS = 0V to 19V h
Conditions
VDS = 10V, ID = 195A
ID = 195A
VGS = 20V
VGS = -20V


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