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BAT54CV データシート(PDF) 6 Page - NXP Semiconductors |
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BAT54CV データシート(HTML) 6 Page - NXP Semiconductors |
6 / 10 page BAT54CV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 15 November 2010 6 of 10 NXP Semiconductors BAT54CV Two Schottky barrier double diodes 10. Packing information [1] For further information and the availability of packing methods, see Section 14. 11. Soldering Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 4000 BAT54CV SOT666 4 mm pitch, 8 mm tape and reel -115 Reflow soldering is the only recommended soldering method. Fig 5. Reflow soldering footprint BAT54CV (SOT666) solder lands placement area occupied area solder paste sot666_fr 2.75 2.45 2.1 1.6 0.4 (6 ×) 0.55 (2 ×) 0.25 (2 ×) 0.6 (2 ×) 0.65 (2 ×) 0.3 (2 ×) 0.325 (4 ×) 0.45 (4 ×) 0.5 (4 ×) 0.375 (4 ×) 1.7 2 1.7 1.075 0.538 Dimensions in mm |
同様の部品番号 - BAT54CV_15 |
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同様の説明 - BAT54CV_15 |
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