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74ALVC16835A データシート(PDF) 2 Page - NXP Semiconductors |
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74ALVC16835A データシート(HTML) 2 Page - NXP Semiconductors |
2 / 12 page Philips Semiconductors Product specification 74ALVC16835A 18-bit registered driver (3-State) 2 2000 Mar 14 853–2190 23314 FEATURES • Wide supply voltage range of 1.2 V to 3.6 V • Complies with JEDEC standard no. 8-1A. • CMOS low power consumption • Direct interface with TTL levels • Current drive ± 24 mA at 3.0 V • MULTIBYTETM flow-through standard pin-out architecture • Low inductance multiple V CC and GND pins for minimum noise and ground bounce • Output drive capability 50 Ω transmission lines @ 85°C • Input diodes to accommodate strong drivers DESCRIPTION The 74ALVC16835A is a 18–bit registered driver. Data flow is controlled by active low output enable (OE), active low latch enable (LE) and clock inputs (CP). When LE is LOW, the A to Y data flow is transparent. When LE is HIGH and CP is held at LOW or HIGH, the data is latched; on the LOW to HIGH transient of CP the A-data is stored in the latch/flip-flop. When OE is LOW the outputs are active. When OE is HIGH, the outputs go to the high impedance OFF–state. Operation of the OE input does not affect the state of the latch/flip-flop. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. PIN CONFIGURATION 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 NC NC Y1 Y2 Y3 Y4 Y5 Y6 GND VCC GND Y7 Y8 Y9 Y10 Y11 Y12 GND Y13 Y14 Y15 VCC Y16 Y17 GND Y18 OE LE GND NC A1 GND A2 A3 VCC A4 A5 A6 GND A7 A8 A9 A10 A11 A12 GND A13 A14 A15 VCC A16 A17 GND A18 CP GND SH00188 QUICK REFERENCE DATA GND = 0 V; Tamb = 25°C; tr = tf ≤ 2.5 ns SYMBOL PARAMETER CONDITIONS TYPICAL UNIT tPHL/tPLH Propagation delay An to Yn; LE to Yn; CP to Yn VCC = 3.3 V, CL = 50 pF 2.3 2.6 2.5 ns fmax Maximum clock frequency VCC = 3.3 V, CL = 50 pF 350 MHz CI Input capacitance 4.0 pF CI/O Input/Output capacitance 8.0 pF C Power dissipation capacitance per buffer V = GND to VCC1 transparent mode Output enabled Output disabled 13 3 pF CPD Power dissipation capacitance per buffer VI = GND to VCC1 Clocked mode Output enabled Output disabled 22 15 pF NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + S (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; S (CL × VCC2 × fo) = sum of outputs. |
同様の部品番号 - 74ALVC16835A_15 |
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