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LM3262 データシート(PDF) 3 Page - Texas Instruments

部品番号 LM3262
部品情報  LM3262 6MHz, 800 mA Miniature, Adjustable, Step-Down DC-DC Converter with Auto Bypass for RF Power Amplifiers
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メーカー  TI [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI - Texas Instruments

LM3262 データシート(HTML) 3 Page - Texas Instruments

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LM3262
www.ti.com
SNVS875N – AUGUST 2012 – REVISED MARCH 2013
ABSOLUTE MAXIMUM RATINGS
(1) (2)
VIN to SGND
−0.2V to +6.0V
PGND to SGND
−0.2V to +0.2V
EN, VCON, BPEN
(SGND
−0.2V) to (VIN+0.2V)
FB, SW
(PGND–0.2V) to VIN+0.2V)
Continuous Power Dissipation
Internally Limited
(3)
Junction Temperature (TJ-MAX)
+150°C
Storage Temperature Range
−65°C to +150°C
Maximum Lead Temperature
(Soldering, 10 sec)
+260°C
ESD Rating (4)
Human Body Model:
2kV
Charged Device Model:
1250V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pins.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and
disengages at TJ = 125°C (typ.).
(4)
The Human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. (MIL-STD-883 3015.7)
OPERATING RATINGS
(1) (2)
Input Voltage Range
2.5V to 5.5V
Recommended Load Current
0mA to 800 mA
PWM Mode
0mA to 800 mA
Bypass Mode
0mA to 1000 mA
Junction Temperature (TJ) Range
−30°C to +125°C
Ambient Temperature (TA) Range
(3)
−30°C to +90°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pins.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
THERMAL PROPERTIES
Junction-to-Ambient Thermal Resistance (
θJA), YFQ09 Package
85°C/W
(1)
(1)
Junction-to-ambient thermal resistance (
θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7.
Copyright © 2012–2013, Texas Instruments Incorporated
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