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LM3262 データシート(PDF) 3 Page - Texas Instruments |
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LM3262 データシート(HTML) 3 Page - Texas Instruments |
3 / 27 page LM3262 www.ti.com SNVS875N – AUGUST 2012 – REVISED MARCH 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) VIN to SGND −0.2V to +6.0V PGND to SGND −0.2V to +0.2V EN, VCON, BPEN (SGND −0.2V) to (VIN+0.2V) FB, SW (PGND–0.2V) to VIN+0.2V) Continuous Power Dissipation Internally Limited (3) Junction Temperature (TJ-MAX) +150°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature (Soldering, 10 sec) +260°C ESD Rating (4) Human Body Model: 2kV Charged Device Model: 1250V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pins. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ = 125°C (typ.). (4) The Human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. (MIL-STD-883 3015.7) OPERATING RATINGS (1) (2) Input Voltage Range 2.5V to 5.5V Recommended Load Current 0mA to 800 mA PWM Mode 0mA to 800 mA Bypass Mode 0mA to 1000 mA Junction Temperature (TJ) Range −30°C to +125°C Ambient Temperature (TA) Range (3) −30°C to +90°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pins. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). THERMAL PROPERTIES Junction-to-Ambient Thermal Resistance ( θJA), YFQ09 Package 85°C/W (1) (1) Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3262 |
同様の部品番号 - LM3262_15 |
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同様の説明 - LM3262_15 |
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