1.

2.

3.

Material Content Data Sheet

Sales Product Name

TLS820F0EL V33

Issued

24. August 2015

MA#

MA001338860

Package

PG-SSOP-14-5

Weight*

82.86 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

1.743

2.10

2.10

21036

21036

leadframe

inorganic material

phosphorus

7723-14-0

0.009

0.01

104

non noble metal

zinc

7440-66-6

0.034

0.04

416

non noble metal

iron

7439-89-6

0.689

0.83

8315

non noble metal

copper

7440-50-8

27.978

33.76

34.64

337643

346478

wire

non noble metal

copper

7440-50-8

0.086

0.10

0.10

1033

1033

encapsulation

organic material

carbon black

1333-86-4

0.100

0.12

1207

plastics

epoxy resin

-

4.600

5.55

55517

inorganic material

silicondioxide

60676-86-0

45.302

54.69

60.36

546723

603447

leadfinish

non noble metal

tin

7440-31-5

0.988

1.19

1.19

11927

11927

plating

noble metal

silver

7440-22-4

0.768

0.93

0.93

9264

9264

glue

plastics

epoxy resin

-

0.141

0.17

1704

noble metal

silver

7440-22-4

0.423

0.51

0.68

5111

6815

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com