データシートサーチシステム |
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ISL28110FBZ データシート(PDF) 3 Page - Intersil Corporation |
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ISL28110FBZ データシート(HTML) 3 Page - Intersil Corporation |
3 / 23 page ISL28110, ISL28210 3 FN6639.3 November 29, 2012 Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING TCVOS (µV/°C) PACKAGE (Pb-free) PKG. DWG. # ISL28110FBZ 28110 FBZ -C 10 (C Grade) 8 Ld SOIC M8.15E ISL28210FBZ 28210 FBZ -C 10 (C Grade) 8 Ld SOIC M8.15E ISL28210SOICEVAL1Z Evaluation Board NOTES: 1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL28110, ISL28210. For more information on MSL please see techbrief TB363. |
同様の部品番号 - ISL28110FBZ |
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同様の説明 - ISL28110FBZ |
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