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LM2930 データシート(PDF) 7 Page - Texas Instruments

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部品番号 LM2930
部品情報  3-Terminal Positive Regulator
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ホームページ  http://www.ti.com
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LM2930 データシート(HTML) 7 Page - Texas Instruments

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LM2930
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SNVS745D – APRIL 1998 – REVISED APRIL 2013
Definition of Terms
Dropout Voltage: The input-output voltage differential at which the circuit ceases to regulate against further
reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value
obtained at 14V input, dropout voltage is dependent upon load current and junction temperature.
Input Voltage: The DC voltage applied to the input terminals with respect to ground.
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated
output voltage for which the regulator will operate.
Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made
under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not
significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with
maximum rated voltage and junction temperature.
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over
a specified frequency range.
Quiescent Current: That part of the positive input current that does not contribute to the positive load current.
The regulator ground lead current.
Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage.
Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room
temperature to either temperature extreme.
Maximum Power Dissipation (TO-220)
Maximum Power Dissipation (SFM) (1)
(1)
Thermal resistance without a heat sink for junction to case temperature is 3°C/W and for case to ambient temperature is 50°C/W for the
TO-220, 73°C/W for the SFM. If the SFM package is used, the thermal resistance can be reduced by increasing the P.C. board copper
area thermally connected to the package. Using 0.5 square inches of copper area,
θJA is 50°C/W; with 1 square inch of copper area, θJA
is 37°C/W; and with 1.6 or more square inches of copper area,
θJA is 32°C/W.
Copyright © 1998–2013, Texas Instruments Incorporated
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