LM2698

www.ti.com

SNVS153E – MAY 2001 – REVISED APRIL 2013

Electrical Characteristics

Min

Typ

Max

Symbol

Parameter

Conditions

Units

(1)

(2)

(1)

Quiescent Current

FB = 0V (Not Switching)

1.3

2.0

mA

5

10

µA

Feedback Voltage

1.2285

1.26

1.2915

V

Switch Current Limit

(3)

1.35

1.9

2.4

A

Feedback Voltage Line

2.2V

0.013

0.1

%/V

Regulation

FB Pin Bias Current

0.5

20

nA

(4)

Input Voltage Range

2.2

12

V

Error Amp Transconductance

ΔI = 5µA

40

135

290

µmho

Error Amp Voltage Gain

120

V/V

Maximum Duty Cycle

FSLCT = Ground

78

85

%

Minimum Duty Cycle

FSLCT = Ground

15

%

30

Switching Frequency

FSLCT = Ground

480

600

720

kHz

1

1.25

1.5

MHz

Shutdown Pin Current

0.01

0.1

µA

−0.5

-1

Switch Leakage Current

0.01

3

µA

0.2

0.4

Ω

SHDN Threshold Voltage

Output High

0.6

0.9

V

Output Low

0.3

0.6

V

UVP

On Threshold

1.95

2.05

2.2

V

Off Threshold

1.85

1.95

2.1

V

Thermal Resistance

Junction to Ambient

235

°C/W

(5)

Junction to Ambient

225

(6)

Junction to Ambient

220

(7)

Junction to Ambient

200

(8)

Junction to Ambient

195

(9)

(1)

All limits are specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits

are 100% tested or specified through statistical analysis. All limits at temperature extremes are specified via correlation using standard

Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

(2)

Typical numbers are at 25°C and represent the most likely norm.

(3)

This is the switch current limit at 0% duty cycle. The switch current limit will change as a function of duty cycle. See Typical performance

(4)

Bias current flows into FB pin.

(5)

Junction to ambient thermal resistance (no external heat sink) for the MSO8 package with minimal trace widths (0.010 inches) from the

pins to the circuit. See "Scenario 'A'" in the Power Dissipation section.

(6)

Junction to ambient thermal resistance for the MSO8 package with minimal trace widths (0.010 inches) from the pins to the circuit and

approximately 0.0191 sq. in. of copper heat sinking. See "Scenario 'B'" in the Power Dissipation section.

(7)

Junction to ambient thermal resistance for the MSO8 package with minimal trace widths (0.010 inches) from the pins to the circuit and

approximately 0.0465 sq. in. of copper heat sinking. See "Scenario 'C'" in the Power Dissipation section.

(8)

Junction to ambient thermal resistance for the MSO8 package with minimal trace widths (0.010 inches) from the pins to the circuit and

approximately 0.2523 sq. in. of copper heat sinking. See "Scenario 'D'" in the Power Dissipation section.

(9)

Junction to ambient thermal resistance for the MSO8 package with minimal trace widths (0.010 inches) from the pins to the circuit and

approximately 0.0098 sq. in. of copper heat sinking on the top layer and 0.0760 sq. in. of copper heat sinking on the bottom layer, with

three 0.020 in. vias connecting the planes. See "Scenario 'E'" in the Power Dissipation section.

Copyright © 2001–2013, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: LM2698