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LM22677 データシート(PDF) 4 Page - Texas Instruments |
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LM22677 データシート(HTML) 4 Page - Texas Instruments |
4 / 28 page LM22677, LM22677-Q1 SNVS582O – SEPTEMBER 2008 – REVISED AUGUST 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT VIN to GND 43 V EN Pin Voltage –0.5 6 V RT/SYNC Pin Voltage –0.5 7 V SW to GND(3) –5 VIN V BOOT Pin Voltage VSW + 7 V FB Pin Voltage –0.5 7 V Power Dissipation Internally Limited Junction Temperature 150 °C For soldering specifications, refer to Application Report Absolute Maximum Ratings for Soldering (SNOA549). Storage temperature, Tstg –65 150 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the absolute maximum ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions. (2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) The absolute-maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a pulse of up to 50 ns. 6.2 ESD Ratings: LM22677 VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 ESD Ratings: LM22677-Q1 VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.4 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Supply Voltage 4.5 42 V Junction Temperature –40 125 °C 6.5 Thermal Information LM22677 THERMAL METRIC(1)(2) NDR (TO-263) UNIT 7 PINS RθJA Junction-to-ambient thermal resistance 22 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). (2) The value of RθJA for the NDR (TJ) package of 22°C/W is valid if package is mounted to 1 square inch of copper. The RθJA value can range from 20 to 30°C/W depending on the amount of PCB copper dedicated to heat transfer. See application note AN-1797 TO-263 THIN Package (SNVA328) for more information. 4 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: LM22677 LM22677-Q1 |
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