NXP Semiconductors

BTA208S-600D

3Q Hi-Com Triac

BTA208S-600D

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Product data sheet

11 August 2014

11 / 14

11. Soldering

SOT428

Footprint information for reflow soldering of DPAK (SOT428) package

sot428_fr

occupied area

solder paste

solder resist

solder lands

Issue date

Dimensions in mm

14-03-12

14-03-17

6.15

5.8

5.9

1.8

7

1.3

1.5

1.4

1.65

4.57

6

6.125

4.725

6.5

0.3

1

1.15

5.65

2.3

2.4

2.45

3.6

6

5.75

4.6

Fig. 14. Reflow soldering footprint for DPAK (SOT428)