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LMR16006YQ5DDCRQ1 データシート(PDF) 4 Page - Texas Instruments |
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LMR16006YQ5DDCRQ1 データシート(HTML) 4 Page - Texas Instruments |
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4 / 23 page  LMR16006Y-Q1 SNVSAC1 – JUNE 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX UNIT VIN to GND -0.3 65 SHDN to GND -0.3 65 Input voltages FB to GND -0.3 7 V CB to SW -0.3 7 SW to GND -1 60 Output voltages SW to GND less than 30 ns transients -2 60 TJ Operation junction temperature -40 150 °C Storage temperature, Tstg -55 165 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Q100-011 ±500 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN 4 40 CB 4 46 Buck regulator CB to SW -0.3 6 V SW -1 40 FB 0 5.5 Control SHDN 0 40 Temperature Operating junction temperature range, TJ -40 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.4 Thermal Information over operating free-air temperature range (unless otherwise noted) THERMAL METRIC (1) LMR16006Y-Q1 UNIT DDC (SOT) (6 PINS) RθJA Junction-to-ambient thermal resistance 102 RθJCtop Junction-to-case (top) thermal resistance 36.9 °C/W RθJB Junction-to board characterization parameter 28.4 (1) All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards. Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, numberof thermal vias, board size, ambient temperature, and air flow. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LMR16006Y-Q1 |
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