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TCP-4118UB-DT データシート(PDF) 5 Page - ON Semiconductor |
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TCP-4118UB-DT データシート(HTML) 5 Page - ON Semiconductor |
5 / 7 page TCP−4118UB www.onsemi.com 5 ASSEMBLY CONSIDERATIONS AND REFLOW PROFILE The following assembly considerations should be observed: Cleanliness These chips should be handled in a clean environment . Electro-static Sensitivity ON Semiconductor’s PTICs are ESD Class 1B sensitive. The proper ESD handling procedures should be used. Mounting The WLCSP PTIC is fabricated for Flip Chip solder mounting. Connectivity to the RF and Bias terminations on the PTIC die is established through SAC305 solder balls with 65 mm nominal height (45 mm to 85 mm height variation). The PTIC die is RoHS-compliant and compatible with lead-free soldering profile. Molding The PTIC die is compatible for over-molding or under-fill. Figure 6. Reflow Profile ORIENTATION OF THE PTIC FOR OPTIMUM LOSSES When configuring the PTIC in your specific circuit design, at least one of the RF terminals must be connected to DC ground. If minimum transition times are required, DC ground on both RF terminals is recommended. To minimize losses, the PTIC should be oriented such that RF2 is at the lower RF impedance of the two RF nodes. A shunt PTIC, for example, should have RF2 connected to RF ground. Figure 7. PTIC Orientation Functional Block Diagram Bias RF ANT RF1 (PTIC Pad) RF2 (PTIC Pad) |
同様の部品番号 - TCP-4118UB-DT |
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同様の説明 - TCP-4118UB-DT |
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