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1N3016B データシート(PDF) 1 Page - Microsemi Corporation

部品番号. 1N3016B
部品情報  Silicon 1 WATT Zener Diodes
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メーカー  MICROSEMI [Microsemi Corporation]
ホームページ  http://www.microsemi.com
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1N3016B Datasheet(HTML) 1 Page - Microsemi Corporation

   
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1 WATT METAL CASE ZENER DIODES
SCOTTSD A L E DIVISION
1N3016B thru 1N3051B
DESCRIPTION
APPEARANCE
This well established zener diode series for the 1N3016 thru 1N3051
JEDEC registration in the metal case DO-13 package provides a glass
hermetic seal for 6.8 to 200 volts. It is also well suited for high-reliability
applications where it is available in JAN, JANTX, and JANTXV military
qualifications.
Lower voltages are also available in the 1N3821 thru
1N3830 series (3.3 V to 7.5 V) in the same package (see separate data
sheet). Microsemi also offers numerous other Zener diode products for a
variety of other packages including surface mount.
DO-13
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
Zener Voltage Range: 6.8V to 200V
Hermetically sealed DO-13 metal package
Internally solder-bonded construction.
Also available in JAN, JANTX, JANTXV
qualifications per MIL-PRF19500/115 by adding the
JAN, JANTX, or JANTXV prefixes to part numbers
for desired level of screening, e.g. JANTX1N3016B,
JANTXV1N3051B, etc.
Surface mount also available with 1N3016BUR-1
thru 1N3051BUR-1 series on separate data sheet
Regulates voltage over a broad operating current
and temperature range
Wide selection from 6.8 to 200 V
Tight voltage tolerances available
Low reverse (leakage) currents
Nonsensitive to ESD
Hermetically sealed metal package
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
Operating Junction and Storage Temperatures:
-65
oC to +175oC
THERMAL RESISTANCE: 50
oC/W* junction to lead
at 0.375 inches (10 mm) from body or 110
oC/W
junction to ambient when leads are mounted on FR4
PC board with 4 mm
2 copper pads (1 oz) and track
width 1 mm, length 25 mm
DC Power Dissipation
*: 1.0 Watt at TL < +125oC 3/8”
(10 mm) from body or 1.0 Watts at TL < +65
oC when
mounted on FR4 PC board as described for thermal
resistance above (also see Fig 1)
Forward Voltage @ 200 mA: 1.5 Volts.
Solder Temperatures: 260
o C for 10 s (maximum)
CASE: DO-13 (DO-202AA), welded, hermetically
sealed metal and glass
FINISH: All external surfaces are Tin-Lead (Pb/Sn)
plated and solderable per MIL-STD-750 method
2026
POLARITY: Cathode connected case.
WEIGHT: 1.4 grams.
Tape & Reel option: Standard per EIA-296 (add
“TR” suffix to part number)
See package dimensions on last page
*
For further mounting reference, thermal resistance from junction to metal case may be reduced to < 20 oC/W
when mounting DO-13 metal case directly on heat sink.
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright
 2003
11-03-2003 REV A


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