LC87F2608A

No.A2175-11/23

Absolute Maximum Ratings at Ta=25

°C, VSS1=0V

Parameter

Symbol

Pin/Remarks

Conditions

Specification

VDD[V]

min

typ

max

unit

Maximum supply

voltage

VDD max

VDD1

-0.3

to

+6.5

V

Input voltage

VI

RES

-0.3

to

VDD+0.3

Input/output

voltage

VIO

• Port 1

• Port 3

-0.3

to

VDD+0.3

Peak output

current

IOPH(1)

Port 1

• CMOS output selected

• Per applicable pin

-7.5

mA

IOPH(2)

Port 3

• CMOS output selected

• Per applicable pin

-10

Mean output

current

(Note 1-1)

IOMH(1)

Port 1

• CMOS output selected

• Per applicable pin

-5

IOMH(2)

Port 3

• CMOS output selected

• Per applicable pin

-7.5

Total output

current

ΣIOAH(1)

• Port 10

• Ports 30, 31

Total of currents at all

applicable pins

-20

ΣIOAH(2)

• Ports 11, 12

• Ports 32, 33

Total of currents at all

applicable pins

-20

ΣIOAH(3)

• Port 1

• Port 3

Total of currents at all

applicable pins

-35

Peak output

current

IOPL(1)

Port 1

Per applicable pin

15

IOPL(2)

Port 3

Per applicable pin

10

Mean output

current

(Note 1-1)

IOML(1)

Port 1

Per applicable pin

10

IOML(2)

Port 3

Per applicable pin

7.5

Total output

current

ΣIOAL(1)

• Port 10

• Ports 30, 31

Total of currents at all

applicable pins

25

ΣIOAL(2)

• Ports 11, 12

• Ports 32, 33

Total of currents at all

applicable pins

35

ΣIOAL(3)

• Port 1

• Port 3

Total of currents at all

applicable pins

55

Power dissipation

Pd max(1)

MFP10S

• Ta=-40 to +85°C

• Independent package

100

mW

Pd max(2)

• Ta=-40 to +85°C

• Mounted on thermal test

board

(Note 1-2)

237

Pd max(3)

MFP10SK

• Ta=-40 to +85°C

• Independent package

100

Pd max(4)

• Ta=-40 to +85°C

• Mounted on thermal test

board

(Note 1-2)

237

Operating ambient

temperature

Topr

-40

to

+85

°C

Storage ambient

temperature

Tstg

-55

to

+125

Note 1-1: Mean output current refers to the average of output currents measured for a period of 100ms.

Note 1-2: Thermal test board used conforms to SEMI (size: 76.1

×114.3×1.6tmm, glass epoxy board).

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating

Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.